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revisions ltr description date (yr-mo-da) approved a changes in accordance with nor 5962-r252-94. 94-07-25 k. a. cottongim b add case outlines t, u, y, and z. 98-02-23 k. a. cottongim c added device type 02. updated table i for the addition of radhard limits for the device type 02. updated paragraph 4.3.5 to add the radhard requirements. redrew entire document. -sld. 02-06-21 raymond monnin rev sheet rev c c c sheet 15 16 17 rev status rev c c c c c c c c c c c c c c of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by steve l. duncan defense supply center columbus standard microcircuit drawing checked by michael jones post office box 3990 columbus, ohio 43216-5000 http://www.d scc.dla.mil this drawing is available for use by all departments approved by kendall a. cottongim microcircuit, hybrid, linear, 15 volt, dual channel, dc-dc converter and agencies of the department of defense drawing approval date 94-05-27 amsc n/a revision level c size a cage code 67268 5962-93193 sheet 1 of 17 dscc form 2233 apr 97 5962-e452-02 distribution statement a . approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents five product assurance cl asses as defined in paragraph 1.2.3 and mil-prf-38534. a choice of case outlines and lead finishes which are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness a ssurance levels are reflected in the pin. 1.2 pin . the pin shall be as shown in the following example: 5962 - 93193 01 h x x ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? federal rha device device case lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 radiation hardness assurance (rha) designator . rha marked devices shall meet the mil-prf-38534 specified rha levels and shall be marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function 01 mfl2815d dc-dc converter, 65 w, 15 v outputs 02 smfl2815d dc-dc converter, 65 w, 15 v outputs 1.2.3 device class designator . this device class designator shall be a single letter identifying the product assurance level. all levels are defined by the requirement s of mil-prf-38534 and require qml certification as well as qualification (class h, k, and e) or qml listing (class g and d). the product assurance levels are as follows: device class device performance documentation k highest reliability class available. this level is intended for use in space applications. h standard military quality class level. this level is intended for use in applications where non-space high reliabilit y devices are required. g reduced testing version of the standard milit ary quality class. this level uses the class h screening and in-process inspections with a possible limited temperature range, manufacturer specified incoming fl ow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (group a, b, c and d). e designates devices which are based upon one of the other classes (k, h, or g) with exception(s) taken to the requirements of that class. these exception(s) must be specified in the device acquisition doc ument; therefore the acquisition document should be reviewed to ensure that the except ion(s) taken will not adversely affect system performance. d manufacturer specified quality class. q uality level is defined by the manufacturers internal, qml certified flow. this product may have a limited temperature range.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 3 dscc form 2234 apr 97 1.2.4 case outline(s) . the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style t see figure 1 12 tabbed flange mount, lead formed up u see figure 1 12 flange mount, lead formed down x see figure 1 12 flange mount, short lead y see figure 1 12 tabbed flange mount, short lead z see figure 1 12 tabbed flange mount, lead formed down 1.2.5 lead finish . the lead finish shall be as specified in mil-prf-38534. 1.3 absolute maximum ratings . 1 / input voltage range (v in )............................................................ -0.5 v dc to +50 v dc power dissipation (p d ): device types 01and 02 (non-rha) ........................................ 16 w device type 02 (rha level r) ................................................ 18 w lead soldering temperatur e (10 seconds )................................. +300 c storage temperature range ....................................................... -65 c to +150 c 1.4 recommended operating conditions . input voltage range (v in )............................................................ +16 v dc to +40 v dc output power ............................................................................. 65 w case operating temperature range (t c ) .................................... -55 c to +125 c 2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless ot herwise specified, the issues of these documents are those liste d in the issue of the department of defense i ndex of specifications and standards (dodi ss) and supplement thereto, cited in the solicitation. specification department of defense mil-prf-38534 - hybrid microcircu its, general specification for. standards department of defense mil-std-883 - test method standard microcircuits. mil-std-1835 - interface standard fo r electronic component case outlines. handbooks 1 / stresses above the absolute maximum ratings may cause permanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 4 dscc form 2234 apr 97 department of defense mil-hdbk-103 - list of standard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specificat ion, standards, and handbooks are ava ilable from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of th is drawing and the references cited herein, the text of this drawing takes precedence. nothing in this docum ent, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item performance requirements fo r device classes d, e, g, h, and k shall be in accordance with mil-prf-38534. compliance with mil-prf- 38534 may include the performance of all tests herein or as designated in the device manufacturer's quality management (qm) plan or as designated for the applicable device class. therefore, the tests and inspections herein may not be per formed for the applicable device class (see mil-prf-38534). furthermore, the manufacturer may take ex ceptions or use alternate methods to the tests and inspections herein and not perform them. however, the performanc e requirements as defined in mil-prf-38534 shall be met for the applicable device class. 3.2 design, construction, and physical dimensions . the design, construction, and physica l dimensions shall be as specified in mil-prf-38534 and herein. 3.2.1 case outline(s) . the case outline(s) shall be in a ccordance with 1.2.4 herein and figure 1. 3.2.2 terminal connections . the terminal connections sha ll be as specified on figure 2. 3.3 electrical perfo rmance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full specified operat ing temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in t able ii. the electrical tests for each subgroup are defined in table i. 3.5 marking of device(s) . marking of device(s) shall be in accordanc e with mil-prf-38534. the device shall be marked with the pin listed in 1.2 herein. in addition, the manufac turer's vendor similar pin may also be marked in mil-hdbk-103 and qml-38534. 3.6 data . in addition to the general performance requirements of mil-prf-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables fo rmat) from the initial quality c onformance inspection group a lot sample, for each device type listed herein. also, the data shoul d include a summary of all parameters manually tested, and for those which, if any, are guaranteed. this data shall be mainta ined under document revision level control by the manufacturer and be made available to the preparing activity (dscc-va) upon request. 3.7 certificate of compliance . a certificate of compliance shall be required fr om a manufacturer in or der to supply to this drawing. the certificate of compliance (o riginal copy) submitted to dscc-va shall a ffirm that the manufacturer's product meets the performance requirements of mil-prf-38534 and herein. 3.8 certificate of conformance . a certificate of conformance as required in mil-prf-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. quality assurance provisions 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance with mil-prf-38534 or as modified in the device manufacturer's quality management (qm) pl an. the modification in the qm plan shall not affect the form, fit, or function as described herein.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 5 dscc form 2234 apr 97 table i. electrical per formance characteristics . limits test symbol conditions 1 / -55 c t c +125 c v in = 28 v dc 0.5 v dc no external sync, c l = 0 unless otherwise specified group a subgroups device types min max unit 1 +14.85 +15.15 i out = 2.17 a dc, (main) 2,3 01,02 +14.55 +15.45 r 1,2,3 02 +14.10 +15.90 1 -14.77 -15.23 i out = 2.17 a dc, (dual) 2,3 01,02 -14.47 -15.53 output voltage v out r 1,2,3 02 -14.02 -15.90 v v in = 16 v, 28 v, and 40 v dc, sum of both outputs 1,2,3 01,02 0.0 4.34 output current 2 / i out r 1,2,3 02 0.0 4.34 a 1 100 i out = 2.17 a, (main) b.w. = 10 khz to 2 mhz 2,3 01,02 150 r 1,2,3 02 175 1 100 i out = 2.17 a, (dual) b.w. = 10 khz to 2 mhz 2,3 01,02 150 v out ripple voltage v rip r 1,2,3 02 175 mvp-p i out = 2.17 a, (main) v in =16 v dc to 40 v dc 1,2,3 01,02 50 r 1,2,3 02 100 i out = 2.17 a, (dual) v in =16 v dc to 40 v dc 1,2,3 01,02 100 v out line regulation vr line r 1,2,3 02 150 mv see footnotes at end of table.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 6 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / -55 c t c +125 c v in = 28 v dc 0.5 v dc no external sync, c l = 0 unless o therwise specified group a subgroups device types min max unit i out = 0 to 2.17 a, (main) 1,2,3 01,02 50 r 1,2,3 02 100 i out = 0 to 2.17 a, (dual) 1,2,3 01,02 150 v out load regulation vr load r 1,2,3 02 250 mv i out = 0 a, inhibit 1 (pin 4) = 0 1,2,3 01,02 14 r 1,2,3 02 17 i out = 0 a, inhibit 2 (pin12) = 0 1,2,3 01,02 70 r 1,2,3 02 90 i out = 0 a, inhibit 1 (pin 4) and inhibit 2 (pin 12) = open 1,2,3 01,02 100 input current i in r 1,2,3 02 130 ma 1 45 i out = 2.17 a, b.w. = 10 khz to 10 mhz 2,3 01,02 50 i in ripple current i rip r 1,2,3 02 75 map-p 01 84 1 02 82 01 82 i out = 2.17 a 2,3 02 80 efficiency eff r 1,2,3 02 79 % see footnotes at end of table.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 7 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / -55 c t c +125 c v in = 28 v dc 0.5 v dc no external sync, c l = 0 unless otherwise specified group a subgroups device types min max unit input to output or any pin to case at 500 v dc, t c = +25 c 1 01,02 100 isolation iso r 1 02 100 m ? no effect on dc performance, t c = +25 c 4 01,02 500 capacitive load 3 / 4 / (each output) c l r 4 02 500 f 1 14 short circuit 2,3 01,02 16 power dissipation load fault p d r 1,2,3 02 18 w i out = 2.17 a 4,5,6 01,02 525 675 switching frquency f s r 4,5,6 02 500 700 khz i out = 2.17 a, ttl level to pin 6 4,5,6 01,02 525 675 external sync range 5 / f sync r 4,5,6 02 525 675 khz 50 percent load to/from 100 percent load 4,5,6 01,02 -600 +600 v out step load transient 6 / v tload r 4,5,6 02 -900 +900 mv pk 50 percent load to/from 100 percent load 4,5,6 01,02 3.0 v out step load transient recovery 4 / 6 / 7 / tt load r 4,5,6 02 4.0 ms i out = 2.17 a, input step from 16 v dc to 40 v dc 4,5,6 01,02 -400 +400 r 4,5,6 02 -500 +500 i out = 2.17 a, input step from 40 v dc to 16 v dc 4,5,6 01,02 -400 +400 v out step line transient 4 / 8 / v tline r 4,5,6 02 -500 +500 mv pk see footnotes at end of table.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 8 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / -55 c t c +125 c v in = 28 v dc 0.5 v dc no external sync, c l = 0 unless otherwise specified group a subgroups device types min max unit i out = 2.17 a, input step from 16 v dc to 40 v dc 4,5,6 01,02 -300 +300 r 4,5,6 02 -400 +400 i out = 2.17 a, input step from 40 v dc to 16 v dc 4,5,6 01,02 -300 +300 v out step line transient recovery 4 / 7 / tt line r 4,5,6 02 -400 +400 s i out = 2.17 a, v in = 0 to 28 v dc 4,5,6 01,02 50 start up overshoot 4 / vton os r 4,5,6 02 75 mv pk i out = 2.17 a, v in = 0 to 28 v dc 4,5,6 01,02 6 start up delay 9 / ton d r 4,5,6 02 12 ms i out = 2.17 a 4,5,6 01,02 4 load fault recovery 4 / tr lf r 4,5,6 02 8 ms 1 / post irradiation testing shall be in accordance with 4.3.5 herein. 2 / the output power available from either output is limited to 45.5 watts (i.e. 70 percent of the total output power). 3 / capacitive load may be any value from 0 to the maximum limit without compromising dc performance. 4 / parameter shall be tested as part of design characterization and after design or process changes; theref ore, the parameter shall be guaranteed to limits specified in table i. 5 / a ttl level waveform (v ih = 4.5 v minimum, v il = 0.8 v maximum) with a 50 percent 10 percent duty cycle applied to the sync input pin (pin 6) within the the sync range frequenc y shall cause the converter's switching frequency to become synchronous with the frequency applied to the sync input pin (pin 6). 6 / load step transition time is 10 microseconds minimum. 7 / recovery time is measured from the initiation of the transient until v out has returned to within 1 percent of its final value. 8 / input step transition time greater than 10 microseconds. 9 / turn-on delay time measurement is eit her for a step application of power at the input or the removal of a ground signal from the inhibit 1 pin (pin 4) or inhibit 2 pin (pin 12) while power is applied to the input.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 9 dscc form 2234 apr 97 case outline t. millimeters inches symbol min max min max a 10.16 .400 a1 5.33 5.84 .210 .230 b 0.89 1.14 .035 .045 d 50.55 51.05 1.990 2.010 d1 37.85 38.35 1.490 1.510 e 5.08 bsc .200 bsc e 69.85 72.39 2.750 2.850 e1 63.25 63.75 2.490 2.510 f 1.14 1.40 .045 .055 l 6.10 6.60 .240 .260 p 3.43 3.68 .135 .145 q/q1 44.20 44.70 1.740 1.760 q2 28.96 29.46 1.140 1.160 s 6.10 6.60 .240 .260 t 10.92 11.43 .430 .450 notes: 1. the u.s. government preferred system of measur ement is the metric si. this item was designed using inch- pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. device weight: 86 grams maximum. figure 1. case outline(s) .
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 10 dscc form 2234 apr 97 case outline u. millimeters inches symbol min max min max a 10.16 .400 a1 5.46 5.72 .215 .225 b 0.89 1.14 .035 .045 d 37.97 38.23 1.495 1.505 e 5.08 bsc .200 bsc e1 3.30 bsc .130 bsc e 87.38 87.88 3.440 3.460 e1 75.95 76.45 2.990 3.010 e2 63.37 63.63 2.495 2.505 f 1.14 1.40 .045 .055 l 6.10 6.60 .240 .260 l1 11.94 12.19 .470 .480 p 3.12 3.38 .123 .133 q 31.88 32.13 1.255 1.265 q1 69.85 70.36 2.750 2.770 s 6.22 6.48 .245 .255 t 5.84 6.86 .230 .270 notes: 1. the u.s. government preferred system of measur ement is the metric si. this item was designed using inch- pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. device weight: 86 grams maximum. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 11 dscc form 2234 apr 97 case outline x. millimeters inches symbol min max min max a 10.16 .400 a1 5.46 5.72 .215 .225 b 0.89 1.14 .035 .045 d 37.97 38.23 1.495 1.505 e 5.08 bsc .200 bsc e1 3.30 bsc .130 bsc e 75.95 76.45 2.990 3.010 e1 63.37 63.63 2.495 2.505 f 1.14 1.40 .045 .055 l 6.10 6.60 .240 .260 l1 5.58 6.10 .220 .240 p 3.12 3.38 .123 .133 q 31.88 32.13 1.255 1.265 q1 69.85 70.36 2.750 2.770 s 6.22 6.48 .245 .255 notes: 1. the u.s. government preferred system of measur ement is the metric si. this item was designed using inch- pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. device weight: 86 grams maximum. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 12 dscc form 2234 apr 97 case outline y. millimeters inches symbol min max min max a 10.16 .400 a1 5.33 5.84 .210 .230 b 0.89 1.14 .035 .045 d 50.55 51.05 1.990 2.010 d1 37.85 38.35 1.490 1.510 e 5.08 bsc .200 bsc e 63.25 63.75 2.490 2.510 f 1.14 1.40 .045 .055 l 6.99 8.26 .275 .325 l1 6.10 6.60 .240 .260 p 3.43 3.68 .135 .145 q/q1 44.20 44.70 1.740 1.760 q2 28.96 29.46 1.140 1.160 s 6.10 6.60 .240 .260 notes: 1. the u.s. government preferred system of measur ement is the metric si. this item was designed using inch- pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. device weight: 86 grams maximum. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 13 dscc form 2234 apr 97 case outline z. millimeters inches symbol min max min max a 10.16 .400 a1 5.33 5.84 .210 .230 b 0.89 1.14 .035 .045 d 50.55 51.05 1.990 2.010 d1 37.85 38.35 1.490 1.510 e 5.08 bsc .200 bsc e 69.85 72.39 2.750 2.850 e1 63.25 63.75 2.490 2.510 f 1.14 1.40 .045 .055 l 6.10 6.60 .240 .260 p 3.43 3.68 .135 .145 q/q1 44.20 44.70 1.740 1.760 q2 28.96 29.46 1.140 1.160 s 6.10 6.60 .240 .260 t 8.64 9.65 .340 .380 notes: 1. the u.s. government preferred system of measur ement is the metric si. this item was designed using inch- pound units of measurement. in case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. device weight: 86 grams maximum. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 14 dscc form 2234 apr 97 device types 01 and 02 case outlines t, u, x, y, and z terminal number terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 input input common tri inhibit 1 sync output sync input positive output output common negative output no connection slave to master master to slave/ inhibit 2 notes: 1. multiple devices may be used in parallel to drive a comm on load. when using this mode of operation the load current is shared by two or three devices. in the current shari ng mode, one device is designated as the master. the slave to master pin (pin 11) of the master device is not connected and the master to slave/i nhibit 2 pin (pin 12) of the master is connected to the slave to master pin (pin 11) of the sl ave device(s). the device(s) des ignated as slave(s) have the master to slave/inhibit 2 pin (pin 11) connected to the output common pin (pin 8). 2. a second slave device may be placed in parallel with a master and slave device, this requires the tri pin (pin 3) of the master device to be connected to the output common pin (pin 8). when paralleled, 95 percent of the sum of the power of the devices is available at the load. this means that 185 watts at 15 volts is available for three devices in parallel. 3. the device has a sync input pin (pin 6) and a sync output pin (pin 5) which allows multiple devices, whether they're in a single unit or master/slave configurati ons to be synchronized to a system clock or each other. two or more devices may be synchronized to each other by connecting the sync output pin (pin 5) of one to the sync input pin (pin 6) of another. 4. the device has two inhibit options, one is ground referenc ed to the input common and the other is referenced to the output common. the output referred inhibit pin uses the master to slave/inhibit 2 pin (pin 12). this pin is normally used to parallel devices, and a ttl compatiable open collector low will inhibit the device when applied to this pin. figure 2. terminal connections .
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 15 dscc form 2234 apr 97 table ii. electrical test requirements . mil-prf-38534 test requirements subgroups (in accordance with mil-prf-38534, group a test table) interim electrical parameters - - - final electrical parameters 1*, 2, 3, 4, 5, 6 group a test requirements 1, 2, 3, 4, 5, 6 group c end-point electrical parameters 1 end-point electrical parameters for radiation hardness assurance (rha) devices 1, 2, 3, 4, 5, 6 * pda applies to subgroup 1. 4.2 screening . screening shall be in accordance with mil-prf- 38534. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or t he acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissi pation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. (2) t a as specified in accordance with table i of method 1015 of mil-std-883. b. interim and final electrical test parameters shall be as spec ified in table ii herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 conformance and periodic inspections . conformance inspection (ci) and periodi c inspection (pi) shall be in accordance with mil-prf-38534 and as specified herein. 4.3.1 group a inspection (ci) . group a inspection shall be in accordance with mil-prf-38534 and as follows: a. tests shall be as specified in table ii herein. b. subgroups 7, 8, 9, 10, and 11 shall be omitted. 4.3.2 group b inspection (pi) . group b inspection shall be in accordance with mil-prf-38534.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 16 dscc form 2234 apr 97 4.3.3 group c inspection (pi) . group c inspection shall be in accordance with mil-prf-38534 and as follows: a. end-point electrical parameters shall be as specified in table ii herein. b. steady-state life test, method 1005 of mil-std-883. (1) test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or t he acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissi pation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. (2) t a as specified in accordance with table i of method 1005 of mil-std-883. (3) test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. 4.3.4 group d inspection (pi) . group d inspection shall be in accordance with mil-prf-38534. 4.3.5. radiation hardness assurance (rha). rha qualification is required only for t hose devices with the rha designator as specified herein. rha level r units total ionizing dose tolerance level 100 krad (si) single event upset survival level (let) 40 mev a. radiation dose rate is in accordance with condition c of method 1019 of mil-std-883. unless otherwise specified, components are tested at a rate of 9 rad(si)/s, in acco rdance with method 1019 of mil-std-750 or mil-std-883, as applicable. b. the manufacturer shall perform a worst-case and radiati on susceptibility analysis on the device. this analysis shall show that the minimum performance requirements of each component has adequate design margin under worst-case operating conditions (extremes of line voltage, temperatur es, load, frequency, radiation environment, etc.). this analysis guarantees the post-irradiation parameter limits specified in table i. c. rha testing shall be performed at the component level fo r initial device qualification, and after design changes that may affect the rha performance of the device. as an alternative to testing, components may be procured to manufacturer radiation guarantees that meet the mini mum performance requirements. component radiation performance guarantees shall be established in compli ance with mil-prf-19500, group d or mil-prf-38535, group e, as applicable. for components with less than adequat e performance margin, component lot radiation acceptance screening shall be performed. d. the manufacturer shall establish pr ocedures controlling component radiation test ing, and shall establish radiation test plans used to implement component lot qualification during pr ocurement. test plans and test reports shall be filed and controlled in accordance with the manufac turer's configuration management system. e. the device manufacturer shall designate a rha program manager to oversee component lot qualification, and to monitor design changes for continued co mpliance to rha requirements. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38534.
standard microcircuit drawing size a 5962-93193 defense supply center columbus columbus, ohio 43216-5000 revision level c sheet 17 dscc form 2234 apr 97 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for gove rnment microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.2 replaceability . microcircuits covered by this drawing will repl ace the same generic device covered by a contractor- prepared specification or drawing. 6.3 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination w ill be accomplished in accordance with mil-prf-38534. 6.4 record of users . military and industrial users shall inform defens e supply center columbus when a system application requires configuration control and the applicable smd. dscc w ill maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. us ers of drawings covering micr oelectronic devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.5 comments . comments on this drawing should be directed to dscc-va, post office box 3990, columbus, ohio 43216- 5000, or telephone (614) 692-1081. 6.6 sources of supply . sources of supply are listed in mil-hdbk- 103 and qml-38534. the vendors listed in mil-hdbk- 103 and qml-38534 have submitted a certificate of compliance (s ee 3.7 herein) to dscc-va and have agreed to this drawing.
standard microcircuit drawing bulletin date: 02-06-21 approved sources of supply for smd 5962-93193 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38534 during the next revisions. mil-hdbk-103 and qml-38534 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accept ed by dscc-va. this bulletin is superseded by the next dated revisions of mil-hdbk-103 and qml-38534. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9319301hta 5962-9319301htc 5962-9319302HTA 5962-9319302htc 5962r9319302hta 5962r9319302htc 5962r9319302kta 5962r9319302ktc 50821 50821 50821 50821 50821 50821 50821 50821 mfl2815dw/883 mfl2815dw/883 smfl2815dw/ho smfl2815dw/ho smfl2815dw/hr smfl2815dw/hr smfl2815dw/kr smfl2815dw/kr 5962-9319301hua 5962-9319301huc 5962-9319302hua 5962-9319302huc 5962r9319302hua 5962r9319302huc 5962r9319302kua 5962r9319302kuc 50821 50821 50821 50821 50821 50821 50821 50821 mfl2815dv/883 mfl2815dv/883 smfl2815dv/ho smfl2815dv/ho smfl2815dv/hr smfl2815dv/hr smfl2815dv/kr smfl2815dv/kr 5962-9319301hxa 5962-9319301hxc 5962-9319302hxa 5962-9319302hxc 5962r9319302hxa 5962r9319302hxc 5962r9319302kxa 5962r9319302kxc 50821 50821 50821 50821 50821 50821 50821 50821 mfl2815d/883 mfl2815d/883 smfl2815d/ho smfl2815d/ho smfl2815d/hr smfl2815d/hr smfl2815d/kr smfl2815d/kr 5962-9319301hya 5962-9319301hyc 5962-9319302hya 5962-9319302hyc 5962r9319302hya 5962r9319302hyc 5962r9319302kya 5962r9319302kyc 50821 50821 50821 50821 50821 50821 50821 50821 mfl2815dy/883 mfl2815dy/883 smfl2815dy/ho smfl2815dy/ho smfl2815dy/hr smfl2815dy/hr smfl2815dy/kr smfl2815dy/kr 5962-9319301hza 5962-9319301hzc 5962-9319302hza 5962-9319302hzc 5962r9319302hza 5962r9319302hzc 5962r9319302kza 5962r9319302kzc 50821 50821 50821 50821 50821 50821 50821 50821 mfl2815dz/883 mfl2815dz/883 smfl2815dz/ho smfl2815dz/ho smfl2815dz/hr smfl2815dz/hr smfl2815dz/kr smfl2815dz/kr 1 / the lead finish shown for each pin representing a herme tic package is the most readily available from the manufacturer listed for that part. if the desired lead fini sh is not listed contact t he vendor to determine its availability. 2 / caution . do not use this number for it em acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. 1 of 2
standard microcircuit drawing bulletin - continued. date: 02-06-21 vendor cage vendor name number and address 50821 interpoint corporation 10301 willows road redmond, wa 98073-9705 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2

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